Wafer Grinder and CMP Tools
N0017325QMB04 · DEPT OF DEFENSE
A SEMICONDUCTOR MACHINERY MANUFACTURING solicitation, performed in Washington, DC, with responses due 2025-02-14. AwardCast estimates what this specific solicitation will close for, before you bid.
What's being bought
See attached combined Synopsis/Solicitation and System Specifications. Note; The Government is accepting offers for both new and refurbished hardware. Contractors response needs to specify whether proposing new or refurbished. Amendment #1 extends the due date for receipt of offers from 2/7/2025 to
Comparable recent awards in SEMICONDUCTOR MACHINERY MANUFACTURING
| Winner | Award value | Offers | Date |
|---|---|---|---|
| INFICON INC | $58K | 1 | 2026-05-26 |
| VACUUM ONE INC | $52K | 36 | 2026-05-14 |
| EBARA TECHNOLOGIES INC | $45K | 18 | 2026-05-05 |
| KURT J LESKER CO | $18K | 3 | 2026-04-17 |
| PLASMABILITY LLC | $630K | 3 | 2025-09-26 |
Questions
What is solicitation N0017325QMB04?
Wafer Grinder and CMP Tools, issued by DEPT OF DEFENSE, under NAICS 333242 (SEMICONDUCTOR MACHINERY MANUFACTURING), performed in Washington, DC. Responses are due 2025-02-14.
What do similar contracts close for?
Comparable closed awards in this category ran from $18K to $630K, across 5 awards shown above. Those are historical results, not a forecast for this solicitation.
Is N0017325QMB04 set aside?
Total Small Business. Check the notice on SAM.gov for the eligibility language that governs.
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